Regional Application Engineer
Henkel Adhesive Technologies
Ornella Tempo has worked as a Regional Application Engineer supporting the Southwest region of the United States. Ornella supports the Technical Customer Service department by communicating with customers, distributors, and Henkel sales representatives to engineer adhesive solutions on a variety of original equipment manufacturing (OEM) applications. This includes testing adhesives in an ISO 17025 laboratory, designing test plans, managing projects through the qualification process, analyzing data, troubleshooting issues, visiting customer manufacturing plants, and integrating dispensing equipment. Additionally, Ornella works with other members of the Henkel team to generate marketing content, create demos, and provide training. Ornella joined Henkel in 2016 in the Technical Information Service department. Ornella holds a Bachelor of Science in Chemical Engineering from the University of Connecticut and is a MBA Candidate at the University of Illinois.
LEARNING THEATER PRESENTATION
Selecting Adhesives and Sealants for Additive Manufacturing
The overall viability of current 3D printing processes as a manufacturing process is often dependent on weighing benefits versus limitations. The high degree of design complexity offered with 3D printing is appealing, but the practical limitations of slow print speed, build envelope and the need for post-processing of parts are challenging. Adhesive bonding may help tip the scale, playing an important role in improving the overall process efficiency.
With Universal Structural Bonders, post processing complexity is greatly reduced by using a one size fits all adhesive. Liquid adhesives in additive manufacturing environments provide a multitude of benefits that include bonding and sealing simultaneously, joining dissimilar materials ranging from Nylon to Aluminum and evenly distribute stress adding durability to the product. With Universal Structural Bonders, no matter what the material, you are assured fast fixture and high bond strengths in your 3D printed assemblies.